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v cc wp scl sda nc nc nc gnd 4 3 2 1 5 6 7 8 8-lead udfn bottom view nc nc nc gnd 1 2 3 4 8 7 6 5 8-lead pdip v cc wp scl sda nc nc nc gnd 1 2 3 4 8 7 6 5 8-lead soic v cc wp scl sda 8-lead tssop 1 2 3 4 8 7 6 5 nc nc nc gnd v cc wp scl sda v cc wp scl sda nc nc nc gnd 1 2 3 4 8 7 6 5 8-ball vfbga bottom view v cc wp scl sda nc nc nc gnd 4 3 2 1 5 6 7 8 8-lead xdfn bottom view 1 2 3 5 4 scl gnd sda wp v cc 5-lead sot23 features ? low-voltage and standard-voltage operation ?v cc = 1.7v to 5.5v ? internally organized 204 8 x 8 (16k) ? two-wire serial interface ? schmitt trigger, filtered inputs for noise suppression ? bidirectional data transfer protocol ? 1mhz (5v, 2.5v), 400khz (1.7v) compatibility ? write protect pin for hardware data protection ? 16-byte page write modes ? partial page writes allowed ? self-timed write cycle (5ms max) ? high-reliability ? endurance: 1 million write cycles ? data retention: 100 years ? 8-lead pdip, 8-lead jedec soic, 8-lead tssop, 8-lead udfn, 8-lead xdfn, 5-lead sot23 and 8-ball vfbga packages ? lead-free/halogen-free ? die sales: wafer form, tape and reel, and bumped wafers description the atmel ? at24c16c provides 16,384-bits of serial electrically erasable and pro- grammable read-only memory (eeprom) organized as 2,048 words of 8-bits each. the device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. the at24c16c is available in space-saving 8-lead pdip, 8-lead jedec soic, 8-lead tssop, 8-lead udfn, 8-lead xdfn, 5-lead sot23, and 8-ball vfbga packages and is accessed via a two-wire serial interface. in addition, the at24c16c operates from 1.7v to 5.5v. figure 0-1. pin configurations pin name function nc no connect sda serial data scl serial clock input wp write protect gnd ground vcc power supply two-wire serial electrically erasable and programmable read-only memory 16k (2048 x 8) atmel at24c16c 8719a?seepr?9/10
2 8719a?seepr?9/10 atmel at24c16c absolute maximum ratings figure 0-2. block diagram operating temperature ........................?55 c to +125 c *notice: stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. exposure to abso- lute maximum rating conditions for extended periods may affect device reliability. storage temperature ...........................?65 c to +150 c voltage on any pin with respect to ground........................... ?1.0v to +7.0v maximum operating voltage................................. 6.25v dc output current .............................................. 5.0 ma start stop logic vcc gnd wp scl sda serial control logic en h.v. pump/timing eeprom data recovery serial mux x dec d out /ack logic comp load inc data w o r d addr/counter y dec r/w d out d in load device address comparator
3 8719a?seepr?9/10 atmel at24c16c 1. pin description serial clock (scl): the scl input is used to positive edge clock data into each eeprom device and negative edge clock data out of each device. serial data (sda): the sda pin is bidirectional for serial data transfer. this pin is open-drain driven and may be wire-ored with any number of other open-drain or open-collector devices. device/page addresses: the atmel ? at24c16c does not use the device address pins, which limits the number of devices on a single bus to one. write protect (wp): the at24c16c has a write protect pin that provides hardware data protection. the write protect pin allows normal read/write operations when connected to ground (gnd). when the write protect pin is connected to v cc , the write protection feature is enabled and operates as shown in table 1-1 . table 1-1. write protect wp pin status part of the array protected 24c16c at v cc full (16k) array at gnd normal read/write operations
4 8719a?seepr?9/10 atmel at24c16c 2. memory organization atmel at24c16c, 16k serial eeprom: internally organized with 128 pages of 16-bytes each, the 16k requires an 11-bit data word address for random word addressing. table 2-1. pin capacitance (1) note: 1. this parameter is characterized and is not 100% tested table 2-2. dc characteristics note: 1. v il min and v ih max are reference only and are not tested applicable over recommended operating range from t a =25 ? c, f = 1.0mhz, v cc = +1.7v symbol test condition max units conditions c i/o input/output capacitance (sda) 8 pf v i/o =0v c in input capacitance (scl) 6 pf v in =0v applicable over recommended operating range from: t ai = ? 40 ? cto+85 ? c, v cc = +1.7v to +5.5v (unless otherwise noted) symbol parameter test condition min typ max units v cc1 supply voltage 1.7 5.5 v i cc1 supply current v cc = 5.0v read at 400khz 1.0 2.0 ma i cc2 supply current v cc = 5.0v write at 400khz 2.0 3.0 ma i sb1 standby current v cc = 1.7v v in =v cc or v ss 1.0 a v cc = 5.5v 6.0 i li input leakage current v cc = 5.0v v in =v cc or v ss 0.10 3.0 a i lo output leakage current v cc = 5.0v v out =v cc or v ss 0.05 3.0 a v il input low level (1) ? 0.6 v cc x 0.3 v v ih input high level (1) v cc x 0.7 v cc + 0.5 v v ol1 output low level v cc = 1.7v i ol = 0.15ma 0.2 v v ol2 output low level v cc = 3.0v i ol = 2.1ma 0.4 v
5 8719a?seepr?9/10 atmel at24c16c table 2-3. ac characteristics (industrial temperature) notes: 1. this parameter is characterized and is not 100% tested 2. ac measurement conditions: r l (connects to v cc ): 1.3 k (2.5v, 5.0v), 10 k (1.7v) input pulse voltages: 0.3 v cc to 0.7 v cc input rise and fall times: 50ns input and output timing reference voltages: 0.5 v cc applicable over recommended operating range from t ai = ? 40 ? cto+85 ? c, v cc = +1.7v to +5.5v, cl = 100 pf (unless otherwise noted). test conditions are listed in note 2. symbol parameter 1.7v 2.5v, 5.0v units min max min max f scl clock frequency, scl 400 1000 khz t low clock pulse width low 1.3 0.4 s t high clock pulse width high 0.6 0.4 s t i noise suppression time (1) 50 50 ns t aa clock low to data out valid 0.05 0.9 0.05 0.55 s t buf time the bus must be free before a new transmission can start (1) 1.3 0.5 s t hd.sta start hold time 0.6 0.25 s t su.sta start set-up time 0.6 0.25 s t hd.dat data in hold time 0 0 s t su.dat data in set-up time 100 100 ns t r inputs rise time (1) 0.3 0.3 s t f inputs fall time (1) 300 100 ns t su.sto stop set-up time 0.6 0.25 s t dh data out hold time 50 50 ns t wr write cycle time 5 5 ms endurance (1) 25c, page mode, 3.3v 1,000,000 write cycles
6 8719a?seepr?9/10 atmel at24c16c 3. device operation clock and data transitions: the sda pin is normally pulled high with an external device. data on the sda pin may change only during scl low time periods (see figure 3-4 on page 7). data changes during scl high periods will indicate a start or stop condition as defined below. start condition: a high-to-low transition of sda with scl high is a start condition which must precede any other command (see figure 3-5 on page 8). stop condition: a low-to-high transition of sda with scl high is a stop condition. after a read sequence, the stop command will place the eeprom in a standby power mode (see figure 3-5 on page 8). acknowledge: all addresses and data words are serially transmitted to and from the eeprom in 8-bit words. the eeprom sends a zero to acknowledge that it has received each word. this happens during the ninth clock cycle. standby mode: the atmel ? at24c16c features a low-power standby mode which is enabled: (a) upon power-up and (b) after the receipt of the stop bit and the completion of any internal operations. 2-wire software reset: after an interruption in protocol, power loss or system reset, any 2-wire part can be protocol reset by following these steps: 1. create a start bit condition 2. clock nine cycles 3. create another start bit followed by stop bit condition as shown below figure 3-1. software reset start bit stop bit start bit dummy clock cycles scl sda 123 89
7 8719a?seepr?9/10 atmel at24c16c figure 3-2. bus timing scl: serial clock, sda: serial data i/o ? figure 3-3. write cycle timing scl: serial clock, sda: serial data i/o note: the write cycle time t wr is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle figure 3-4. data validity scl sda in sda out t f t high t low t low t r t aa t dh t buf t su.sto t su.dat t hd.dat t hd.sta t su.sta scl sda t wr (1) stop condition start condition wordn ack 8th bit sda scl data stable data stable data change
8 8719a?seepr?9/10 atmel at24c16c figure 3-5. start and stop definition figure 3-6. output acknowledge sda scl start stop scl data i n data out start acknowledge 9 8 1
9 8719a?seepr?9/10 atmel at24c16c 4. device addressing the 16k eeprom device requires an 8-bit device address word following a start condition to enable the chip for a read or write operation (refer to figure 6-1). the device address word consists of a mandatory one, zero sequence for the first four most significant bits as shown. this is common to all the eeprom devices. the next three bits used for memory page addressing and are the most significant bits of the data word address which follows. the eighth bit of the device address is the read/write operation select bit. a read operation is initiated if this bit is high and a write operation is initiated if this bit is low. upon a compare of the device address, the eeprom will output a zero. if a compare is not made, the chip will return to a standby state. 5. write operations byte write: a write operation requires an 8-bit data word address following the device address word and acknowledgment. upon receipt of this address, the eeprom will again respond with a zero and then clock in the first 8-bit data word. following receipt of the 8-bit data word, the eeprom will output a zero and the addressing device, such as a microcontroller, must terminate the write sequence with a stop condition. at this time the eeprom enters an internally timed write cycle, t wr , to the nonvolatile memory. all inputs are disabled during this write cycle and the eeprom will not respond until the write is complete (see figure 6-2 on page 10). page write: the 16k eeprom is capable of an 16-byte page write. a page write is initiated the same as a byte write, but the microcontroller does not send a stop condition after the first data word is clocked in. instead, after the eeprom acknowledges receipt of the first data word, the microcontroller can transmit up to fifteen data words. the eeprom will respond with a zero after each data word received. the microcontroller must terminate the page write sequence with a stop condition (see figure 6-3 on page 11). the data word address lower four bits are internally incremented following the receipt of each data word. the higher data word address bits are not incremented, retaining the memory page row location. when the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. if more than sixteen data words are transmitted to the eeprom, the data word address will ?roll over? and previous data will be overwritten. acknowledge polling: once the internally timed write cycle has started and the eeprom inputs are disabled, acknowledge polling can be initiated. this involves sending a start condition followed by the device address word. the read/write bit is representative of the operation desired. only if the internal write cycle has completed will the eeprom respond with a zero allowing the read or write sequence to continue.
10 8719a?seepr?9/10 atmel at24c16c 6. read operations read operations are initiated the same way as write operations with the exception that the read/write select bit in the device address word is set to one. there are three read operations: current address read, random address read and sequential read. current address read: the internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. this address stays valid between operations as long as the chip power is maintained. the address ?roll over? during read is from the last byte of the last memory page to the first byte of the first page. the address ?roll over? during write is from the last byte of the current page to the first byte of the same page. once the device address with the read/write select bit set to one is clocked in and acknowledged by the eeprom, the current address data word is serially clocked out. the microcontroller does not respond with an input zero but does generate a following stop condition (see figure 6-4 on page 11). random read: a random read requires a ?dummy? byte write sequence to load in the data word address. once the device address word and data word address are clocked in and acknowledged by the eeprom, the microcontroller must generate another start condition. the microcontroller now initiates a current address read by sending a device address with the read/write select bit high. the eeprom acknowledges the device address and serially clocks out the data word. the microcontroller does not respond with a zero but does generate a following stop condition (see figure 6-5 on page 11). sequential read: sequential reads are initiated by either a current address read or a random address read. after the microcontroller receives a data word, it responds with an acknowledge. as long as the eeprom receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. when the memory address limit is reached, the data word address will ?roll over? and the sequential read will continue. the sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition (see figure 6-6 on page 11). figure 6-1. device address figure 6-2. byte write msb lsb 1 0 1 0 p 2 p 1 p 0 r/w 16k s t a r t w r i t e s t o p device address word address data sda line m s b a c k r / w a c k a c k
11 8719a?seepr?9/10 atmel at24c16c figure 6-3. page write figure 6-4. current address read figure 6-5. random read figure 6-6. sequential read sda line s t a r t w r i t e device address word address (n) data (n) data (n + 1) data (n + x) m s b a c k r / w a c k a c k a c k a c k s t o p sda line s t a r t device address r e a d s t o p m s b a c k r / w n o a c k data sda line s t a r t s t a r t w r i t e device address device address word address n r e a d s t o p m s b a c k r / w n o a c k data n dummy write a c k a c k sda line device address r e a d a c k a c k a c k s t o p a c k r / w n o a c k data n data n + 1 data n + 2 data n + x
12 8719a?seepr?9/10 atmel at24c16c 7. ordering code detail 8. part markings atmel at24c16c-pum atmel designator product family device density device revision shipping carrier option operating voltage package device grade or wafer/die thickness 16 = 16k b or blank = bulk (tubes) t = tape and reel m = 1.7 v to 5.5 v operating voltage p = pdip ss = jedec soic x = tssop ma = udfn me = xdfn st = sot23 c = vfbga wwu = wafer unsawn wdt = die in tape and reel h = green, nipdau lead finish industrial temperature range (-40c to +85c) u = green, matte sn lead finish, industrial temperature range (-40c to +85c) 11 = 11 mil wafer thickness at24c16c-sshm-b |---|---|---|---|---|---|---|---| a t m l u y w w |---|---|---|---|---|---|---|---| 1 6 c m @ |---|---|---|---|---|---|---|---| atmel lot number |---|---|---|---|---|---|---|---| | pin 1 indicator (dot) (top side only mark) line 1: at=atmel h=material set/grade yww=date code line 2: 16c=at24c16c, m=1.7v to 5.5v, @=country of assembly line 3: atmel lot number
13 8719a?seepr?9/10 atmel at24c16c atmel at24c16c-sshm atmel at24c16c-xhm atmel at24c16c-mahm |---|---|---|---|---|---|---|---| a t m l h y w w |---|---|---|---|---|---|---|---| 1 6 c m @ |---|---|---|---|---|---|---|---| atmel lot number |---|---|---|---|---|---|---|---| | pin 1 indicator (dot) line 1: atml=atmel h=material set/grade yww=date code line 2: 16c=at24c16c, m=1.7 to 5.5v, @=country of assembly line 3: atmel lot number pin 1 indicator (dot) | |---|---|---|---|---|---| * a t h y w w |---|---|---|---|---|---| 1 6 c m @ |---|---|---|---|---|---|---| atmel lot number |---|---|---|---|---|---|---| line 1: at=atmel, h=material set/grade, yww=date code line 2: 16c=at24c16c, m=1.7 to 5.5v, @=country of assembly line 3: atmel lot number |---|---|---| 1 6 c |---|---|---| h m @ |---|---|---| y x x |---|---|---| * | pin 1 indicator (dot) line 1: 16c=at24c16c line 2: h=material set/grade, m=1.7 to 5.5v, @=country of assembly line 3: y=date code, xx=trace code
14 8719a?seepr?9/10 atmel at24c16c atmel at24c16c-mehm atmel at24c16c-stum atmel at24c16c-cum |---|---|---| 1 6 c |---|---|---| y x x |---|---|---| * | pin 1 indicator (dot) line 1: 16c=at24c16c line 2: y=date code, xx=trace code top mark |---|---|---|---|---| 1 6 c m u |---|---|---|---|---| * | pin 1 indicator (dot) top mark: 16c=at24c16c, m=1.7v to 5.5v, u=material set/grade bottom side marking |---|---|---|---| y m x x |---|---|---|---| bottom mark: ym=date code xx=trace code |---|---|---|---| 1 6 c u |---|---|---|---| y m x x |---|---|---|---| |<-- pin 1 this corner line 1: 16c=at24c16c, u=material set/grade line 2: ym=date code, xx=trace code
15 8719a?seepr?9/10 atmel at24c16c 9. ordering codes atmel at24c16c ordering information notes: 1. "-b" denotes bulk delivery 2. "-t" denotes tape and reel delivery. soic = 4k/reel. tssop, udfn, xdfn, sot23, and vfbga = 5k/reel 3. for wafer sales, please contact atmel sales ordering codes voltage package operating range at24c16c-pum (bulk form only) 1.7 to 5.5 8p3 lead-free/halogen-free industrial temperature (-40c to 85c) at24c16c-sshm-b (1) (nipdau lead finish) 1.7 to 5.5 8s1 AT24C16C-SSHM-T (2) (nipdau lead finish) 1.7 to 5.5 8s1 at24c16c-xhm-b (1) (nipdau lead finish) 1.7 to 5.5 8a2 at24c16c-xhm-t (2) (nipdau lead finish) 1.7 to 5.5 8a2 at24c16c-mahm-t (2) (nipdau lead finish) 1.7 to 5.5 8y6 at24c16c-mehm-t (2) (nipdau lead finish) 1.7 to 5.5 8me1 at24c16c-stum-t (2) (matte sn) 1.7 to 5.5 5ts1 at24c16c-cum-t (2) (matte sn) 1.7 to 5.5 8u3-1 at24c16c-wwu11m (3) 1.7 to 5.5 die sales industrial temperature (-40c to 85c) package type 8p3 8-lead, 0.300" wide, plastic dual inline package (pdip) 8s1 8-lead, 0.150" wide, plastic gull wing small outline (jedec soic) 8a2 8-lead, 4.4mm body, plastic, thin shrink small outline package (tssop) 8y6 8-lead, 2.00mm x 3.00mm body, 0.50mm pitch, ultra thin dual no lead package (udfn) 8me1 8-lead, 1.80mm x 2.20mm body, (xdfn) 5ts1 5-lead, 1.60mm body, plastic thin shrink small outline package (sot-23) 8u3-1 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, small die ball grid array (vfbga)
16 8719a?seepr?9/10 atmel at24c16c 10. packaging information 8p3 ? pdip package drawing contact: packagedrawings@atmel.com drawing no. rev. title gpc notes: 1. this drawing is for general information only; refer to jedec drawing ms-001, variation ba for additional information. 2. dimensions a and l are measured with the package seated in jedec seating plane gauge gs-3. 3. d, d1 and e1 dimensions do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.010 inch. 4. e and ea measured with the leads constrained to be perpendicular to datum. 5. pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include dambar protrusions. dambar protrusions shall not exceed 0.010 (0.25 mm). common dimensions (unit of measure = inches) symbol min nom max note d d1 e e1 e l b2 b a2 a 1 n ea c b3 4 plcs a 0.210 2 a2 0.115 0.130 0.195 b 0.014 0.018 0.022 5 b2 0.045 0.060 0.070 6 b3 0.030 0.039 0.045 6 c 0.008 0.010 0.014 d 0.355 0.365 0.400 3 d1 0.005 3 e 0.300 0.310 0.325 4 e1 0.240 0.250 0.280 3 e 0.100 bsc ea 0.300 bsc 4 l 0.115 0.130 0.150 2 top view side view end view 8p3 c 07/19/10 8p3, 8-lead, 0.300? wide body, plastic dual in-line package (pdip) ptc
17 8719a?seepr?9/10 atmel at24c16c 8s1 ? jedec soic package drawing contact: packagedrawings@atmel.com drawing no. rev. title gpc common dimensions (unit of measure = mm) symbol min nom max note a1 0.10 ? 0.25 a 1.35 ? 1.75 b 0.31 ? 0.51 c 0.17 ? 0.25 d 4.80 ? 5.05 e1 3.81 ? 3.99 e 5.79 ? 6.20 e 1.27 bsc l 0.40 ? 1.27 ? ? 0 ? 8 ? ? e e 1 1 n n top view t o p v i e w c c e1 e 1 end view a a b b l l a1 a 1 e e d d side view s i d e v i e w 8s1 f 5/19/10 notes: this drawing is for general information only. refer to jedec drawing ms-012, variation aa for proper dimensions, tolerances, datums, etc. 8s1, 8-lead (0.150? wide body), plastic gull wing small outline (jedec soic) swb
18 8719a?seepr?9/10 atmel at24c16c 8a2 ? tssop package drawing contact: packagedrawings@atmel.com drawing no. rev. title gpc common dimensions (unit of measure = mm) symbol min nom max note d 2.90 3.00 3.10 2, 5 e 6.40 bsc e1 4.30 4.40 4.50 3, 5 a ? ? 1.20 a2 0.80 1.00 1.05 b 0.19 ? 0.30 4 e 0.65 bsc l 0.45 0.60 0.75 l1 1.00 ref side view end view top view a2 a l l1 d 1 2 3 e1 n b pin 1 indicator this corner e e notes: 1. this drawing is for general information only. refer to jedec drawing mo-153, variation aa, for proper dimensions, tolerances, datums, etc. 2. dimension d does not include mold flash, protrusions or gate burrs. mold flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. 3. dimension e1 does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 0.25 mm (0.010 in) per side. 4. dimension b does not include dambar protrusion. allowable dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. dambar cannot be located on the lower radius of the foot. minimum space between protrusion and adjacent lead is 0.07 mm. 5. dimension d and e1 to be determined at datum plane h. 8a2 e 5/19/10 8a2, 8-lead 4.4mm body, plastic thin shrink small outline package (tssop) tnr
19 8719a?seepr?9/10 atmel at24c16c 8y6 ? mini map package drawing contact: packagedrawings@atmel.com drawing no. gpc rev. title 8y6 ynz e 11/21/08 8y6 , 8-lead, 2.0x3.0 mm body, 0.50 mm pitch, ultrathin mini-map, dual no lead package (sawn)(udfn) common dimensions (unit of measure = mm) symbol min nom max note 1.40 ? ? 0.00 ? 0.20 0.20 d e d2 e2 a a1 a2 a3 l e b 2.00 bsc 3.00 bsc 1.50 ? ? 0.02 ? 0.20 ref 0.30 0.50 bsc 0.25 1.60 1.40 0.60 0.05 0.55 0.40 0.30 2 a2 pin 1 index area a3 d e b (8x) pin 1 id a1 a l (8x) e (6x) 1.50 ref. d2 e2 notes: 1. this drawing is for general information only. refer to jedec drawing mo-229, for proper dimensions, tolerances, datums, etc. 2. dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. if the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. 3. soldering the large thermal pad is optional, but not recommended. no electrical connection is accomplished to the device through this pad, so if soldered it should be tied to ground
20 8719a?seepr?9/10 atmel at24c16c 8me1 ? xdfn common dimensions (unit of measure = mm) symbol min nom max note package drawing contact: packagedrawings@atmel.com drawing no. rev. title gpc 8me1 a 8/3/09 8me1, 8-lead (1.80 x 2.20 mm body) extra thin dfn (xdfn) dtp ? 0.00 1.70 2.10 0.15 0.26 a a1 d e b e e1 l ? ? 1.80 2.20 0.20 0.40 typ 1.20 ref 0.30 0.40 0.05 1.90 2.30 0.25 0.35 bottom view top view side view 8 7 6 5 1 2 3 4 d e pin #1 id a1 a pin #1 id e1 b l e b 0.10 0.15
21 8719a?seepr?9/10 atmel at24c16c 5ts1 ? sot23 package drawing contact: packagedrawings@atmel.com drawing no. rev. title gpc notes: 1. dimensions d does not include mold flash, protrusions or gate burrs. mold flash protrusions or gate burrs shall not exceed 0.15 mm per end. dimensions e1 does not include interlead flash or protrusion. interlead flasg or protrusion shall not exceed 0.15 mm per side. 2. the package top may be smaller than the package bottom. dimensions d and e1 are deteremined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body. 3. these dimensions apply to the flat section of the lead between 0.08 mm and 0.15 mm from the lead tip. 4. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.80 mm total in excess of the ?b? dimension at maximum material condition. the dambar cannot be located on the lower radius of the foot. minimum space between protrusion and an adjacent lead shall not be less than 0.07 mm. 5. this drawing is for general information only. refer to jedec drawing mo-193, variation ab for additional information. 5ts1 b 11/05/08 5ts1 , 5-lead, 1.60 mm body, plastic thin shrink small outline package (shrink sot) tsz end view top view side view common dimensions (unit of measure = mm) symbol min nom max note ? 0.00 0.70 0.08 0.30 a a1 a2 c d e e1 l1 e e1 b ? ? 0.90 ? 2.90 bsc 2.80 bsc 1.60 bsc 0.60 ref 0.95 bsc 1.90 bsc ? 1.10 0.10 1.00 0.20 0.50 3 1, 2 1, 2 1, 2 3, 4 e1 e e1 54 2 3 1 l c c l1 a b e a2 a1 d seating plane
22 8719a?seepr?9/10 atmel at24c16c 8u3-1 ? dbga2 package drawing contact: packagedrawings@atmel.com drawing no. rev. title gpc 8u3-1 d 07/14/10 8u3-1, 8-ball, 1.50 x 2.00 mm body, 0.50 pitch, vfbga package (dbga2) gxu common dimensions (unit of measure - mm) symbol min nom max note a 0.73 0.79 0.85 a1 0.09 0.14 0.19 a2 0.40 0.45 0.50 b 0.20 0.25 0.30 2 d 1.50 bsc e 2.0 bsc e 0.50 bsc e1 0.25 ref d 1.00 bsc d1 0.25 ref 1. this drawing is for general information only. 2. dimension ?b? is measured at maximum solder ball diameter. 3. solder ball composition shall be 95.5sn-4.0ag-.5cu. notes: a 2 side view a pin 1 ball pad corner top view e d a 1 5. b 8 solder balls bottom view (d1) d 4 3 2 (e1) 6 e 5 7 pin 1 ball pad corner 1 8
23 8719a?seepr?9/10 atmel at24c16c 11. revision history doc. rev. date comments 8719a 09/2010 initial document release
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